TMP Worldwide to Share Recruiting Expertise at HCI's 2014 Strategic Talent Acquisition Conference

June 05


TMP Worldwide Advertising & Communications, LLC, a global, tech-enabled talent acquisition company

Will share social, mobile and digital recruiting expertise as a Diamond sponsor of the Human Capital Institute's 2014 Strategic Talent Acquisition Conference.

The conference will be held Wednesday, June 11 through Friday, June 13, 2014.

2014 Strategic Talent Acquisition Conference
Seaport Boston Hotel & Seaport World Trade Center
1 Seaport Lane
Boston, Mass.

TMP Worldwide will exhibit its solutions at booth no. 53.

After years of stagnant hiring, the competition for top performers and technical talent is on the rise. Yet many companies are stymied by finding the right people today to lead their future success. Employers worldwide continue to struggle with a lack of skilled talent and an inability to fill vacancies. With a full schedule of informative sessions designed to provide attendees with insight into talent acquisition's biggest challenges and share proven solutions for enhancing their recruiting efforts, the Human Capital Institute's 2014 Strategic Talent Acquisition Conference will give companies access to tactical information that can be implemented now while strategically preparing for tomorrow.

A Diamond sponsor of this year's conference, TMP Worldwide is committed to providing companies with the latest digital, social and mobile recruiting technologies and creative multi-channel solutions to help revolutionize their talent attraction and employer brand strategies. Talent acquisition professionals can visit TMP's experts at booth no. 53 to understand how they can assess their current employer brand and shape it to attract the best and brightest candidates.

The 2014 Strategic Talent Acquisition Conference will gather some of the industry's most prominent thought leaders to share best practices for recruiting in today's highly connected digital world. Additional details and registration can be accessed at:

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